3D imaging of semiconductor components by discrete laminography

Title3D imaging of semiconductor components by discrete laminography
Publication TypeConference Paper
Year of Publication2014
AuthorsBatenburg, K. J., W J. Palenstijn, and J. Sijbers
Conference NameStress induced phenomena and reliability in 3D microelectronics: AIP Conference Proceedings
Volume1601
Pagination168-179
DOI10.1063/1.4881350
Research area: